semiconductor chip

Integration of ferroelectric thin film and semiconductor creates a new generation of non volatile memories. The ferroelectric non volatile memories have some advantages over the classical semiconductor memorizers, and they are the ideal memory chip for IC card.

铁电薄膜与半导体集成产生了新一代非易失存储器，与传统的半导体非易失存储器比较具有突出的优点，是新一代IC卡的理想存储芯片。

The digital interface of the chip uses SPI interface and is also compatible with the Microwire interface of National Semiconductor.

芯片数字接口部分使用SPI接口同时也与国家半导体公司Microwire接口兼容。

Progress on NSFC major research plan "semiconductor integrated system on a chip"

半导体集成化芯片系统基础研究重大研究计划进展综述

Package and Electrostatic Discharge Failure Analysis of Power Semiconductor Device Chip

功率器件芯片封装和静电放电失效分析

This technology can be widely used for chip encapsulation in the field of micro-electronics. The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip.

这一技术可以广泛应用于微电子行业中的芯片封装技术，它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。

Intel is consolidating its semiconductor testing and packaging operations, the most labour-intensive part of chip production, in Chengdu in the province of Sichuan to cut costs, a move that will erase 2,000 jobs at the chipmaker's Shanghai plant.

英特尔（Intel）正将芯片制造过程中劳动力最密集的环节&半导体测试和封装业务，集中到四川成都进行，以节省成本。此举意味着该芯片制造商上海工厂的2000个职位将不保。

DRAM is a semiconductor chip used in most electronic products such as personal computers.

动态随机存取记忆体是应用于电子产品的半导体晶片，如个人电脑等。

Mr Chang said on Thursday that the era of rapid growth for the chip industry had ended in 2000, although the foundry sector is still expected to slightly outperform the overall semiconductor industry.

张忠谋周四表示，芯片业快速增长的时代在2000年已经结束，不过预计代工产业仍将略好于半导体产业的总体表现。

Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

Ultrasonic Wire welding machine is used in semiconductor manufacturing processes which welding the chip and pin outside the framework.

超声波铝丝焊接机是运用于半导体生产工序中晶片与引脚外框架间引线的焊接的设备。

Fixed abrasive wire is considered as one of the most promising methods in slicing of large size semiconductor chip and function crystal because of its incomparable advantages.

在大尺寸半导体基片和功能晶体的切割中，固结磨料线锯以无可比拟的优点被认为是最有前途的切割方法之一。

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

SEM analysis of cross sections for semiconductor chip

半导体芯片截面的扫描电镜分析